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Immersion Cooling of High-Power Electronics
Bastanci . H. and M. S. El-Genk, “Effects of Inclination Angle and Subcooling on Nucleate Boiling and Critical Heat Flux of HFE-7100,” Proc. 12th International Heat Transfer Conference, Grenoble, France, August 2002. (Refereed Article)
El-Genk, M. S. and Jack Parker, “Pool Boiling in Saturated and Subcooled FC-72 Dielectric Fluid from a Porous Graphite Surface,” Proceedings ASME International Mechanical Engineering Congress, paper No. IMECE2004-59905 Anaheim, CA, 13 – 19 November 2004. (Refereed Article)
El-Genk, M. S. and Jack Parker, “Pool Boiling in Saturated and Subcooled HFE-7100 Dielectric Fluid from a Porous Graphite Surface,” Proceedings of 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ( Itherm 2004), 1, 2004, 655 – 662. (Refereed Article)
El-Genk, M.S., H. H. Saber, and J. Parker, “Thermal Analyses of Composite Copper/Porous Graphite Spreaders for Immersion Cooling Applications,” Proceedings of Conference on Integration and Packaging of MEMS, NEMS, and Electronics (InterPack’05), Paper No. IPACK2005-73226, San Francisco, CA17-22 July 2005. (Refereed Article)
Parker, J.L. and M. S. El-Genk, “Effect of Inclination on Pool Boiling of FC-72 Dielectric Liquid on Porous Graphite,” Proceedings 2005 ASME Summer Heat Transfer Conference, paper No. HT2005-72289, San Francisco, CA, 17 – 22 July 2005. (Refereed Article)
El-Genk, M. S, H. H. Saber, and J. L. Parker, “Efficient Spreaders for Cooling High Performance Computer Chips,” J. Applied Thermal Engineering (Submitted for review, 2 September 2005). (Refereed Article)
Parker. J. L. and M. S. El-Genk, “Enhanced Saturation and Subcooled Boiling of FC-72 Dielectric Liquid,” Int. J. Heat and Mass Transfer, 48, 2005, 3736 – 3752. (Refereed Article)
Parker, J. L. and M. S. El-Genk, “Effect of Surface Orientation on Nucleate Boiling of FC-72 on Porous Graphite,” J. Heat Transfer (in print, March 2006). (Refereed Article)
H.H. Saber, "Composite Spreader for Cooling Computer Chip with Non-Uniform Heat Dissipation," IEEE Transactions on Components and Packaging Technologies (Submitted for Review, April 18, 2006)
El-Genk, M. S. and H. H. Saber, “Composite Spreader for Submersion Cooling of a Computer Chip with Non-Uniform Heat Dissipation,” Proceedings of ITherm 2006, San Diego, CA, May 30 – June 2, 2006. (Refereed Article)
El-Genk, M. S, H. H. Saber, and J. L. Parker, “Efficient Spreaders for Cooling High Performance Computer Chips,” J. Applied Thermal Engineering, 27, 5-6, 2007, 1072 – 1088.
Parker, J.L. and M. S. El-Genk, “Subcooled Boiling of Dielectric Liquids on Porous Graphite at Different Orientations,” Proceedings 13th International Heat Transfer Conference, Paper No. BOI-36, Sydney, Australia, 13-18, 2006.
Parker, J. L., and M. S. El-Genk, “Enhanced Saturation Boiling of HFE-7100 Dielectric Liquid on Extended Copper Surfaces,” Proceedings ASME-JSME Thermal Engineering Summer Heat Transfer Conference, Paper no. HT2007-32496, Vancouver, British Colombia, Canada, 8 – 12 July, 2007.
El-Genk, M.S. and H. H. Saber, “Composite Spreader for Cooling Computer Chip with Non-Uniform Heat Dissipation,” IEEE Transactions on Components and Packaging Technologies, 31(1), 2008, 165 – 172.
El-Genk, M. S. and In-Hwan Yang, “Friction Numbers and Viscous Dissipation Heating for Laminar Flows of Water in Micro-tubes,” J. Heat Transfer (in print, October 2008).
Parker, J. L., and M. S. El-Genk, “Subcooled Boiling of HFE-7100 Dielectric Liquid on Copper surfaces with Corner Pins,” Proceedings 5th European Thermal-Science Conference, Eindhoven, The Netherland, 18 – 22 May 2008.
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