Book

  • Y.-L. Shen
    Constrained Deformation of Materials
    Springer, New York, 2010 (ISBN: 978-1-4419-6311-6)

    Journal Articles & Book Chapters

  • Jinn P. Chu, Chia-Chi Yu, Yusuke Tanatsugu, Mikito Yasuzawa and Yu-Lin Shen
    "Non-stick syringe needles: Beneficial effects of thin film metallic glass coating"
    Scientific Reports , 6, 31847 (2016).

  • R. D. Jamison and Y.-L. Shen
    "Indentation and Overall Compression Behavior of Multilayered Thin-Film Composites: Effect of Undulating Layer Geometry"
    Journal of Composite Materials , 50, 507-521 (2016).

  • C. R. Mayer, L. W. Yang, S. S. Singh, J. Llorca, J. M. Molina-Aldareguia, Y.-L. Shen and N. Chawla
    "Anisotropy, Size, and Aspect Ratio Effects on Micropillar Compression of Al-SiC Nanolaminate Composites"
    Acta Materialia , 114, 25-32 (2016).

  • Y.-L. Shen, G. C. Flores and J. Guthrie
    "Numerical Study of Microbump Failure in 3D Microelectronic Structures"
    Microelectronics Reliability , 61, 48-55 (2016).

  • N. J. Martinez and Y.-L. Shen
    "Analysis of Indentation-Derived Power-Law Creep Response"
    Journal of Materials Engineering and Performance , 25, 1109-1116 (2016).

  • C. Mayer, L. W. Yang, S. S. Singh, H. Xie, Y.-L. Shen, J. Llorca, J. Molina-Aldareguia and N. Chawla
    "Orientation Dependence of Indentation behavior in Al-SiC Nanolaminate Composites"
    Materials Letters , 168, 129-133 (2016).

  • R. Morusupalli, R. Rao, T.-K. Lee, Y.-L. Shen, M. Kunz, N. Tamura and A. S. Budiman
    "Critical temperature shift for Stress Induced Voiding in Advanced Cu Interconnects for 32 nm and beyond"
    Procedia Engineering , 139, 32-40 (2016).

  • R. D. Jamison and Y.-L. Shen
    "Delamination Analysis of Metal-Ceramic Multilayer Coatings Subject to Nanoindentation"
    Surface & Coatings Technology , 303, 3-11 (2016).

  • Y.-L. Shen
    "Numerical study of solder bond failure in photovoltaic modules"
    Procedia Engineering , 139, 93-100 (2016).

  • T. Tian, R. Morusupalli, H. Shin, H.-Y. Son, K.-Y. Byun, J.-C. Joo, R. Caramto, L. Smith, Y.-L. Shen, M. Kunz, N. Tamura and A. S. Budiman
    "On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology"
    Procedia Engineering , 139, 101-111 (2016).

  • J. Dou and Y.-L. Shen
    "Chip Warpage Induced by Tapered Through-Silicon Vias: A Numerical Analysis"
    IEEE Transactions on Device and Materials Reliability , 15, 629-632 (2015).

  • R. D. Jamison and Y.-L. Shen
    "Indentation-Derived Elastic Modulus of Multilayer Thin Films: Effect of Unloading Induced Plasticity"
    Journal of Materials Research , 30, 2279-2290 (2015).

  • M. E. Cordova and Y.-L. Shen
    "Indentation vs. Uniaxial Power-law Creep: A Numerical Assessment"
    Journal of Materials Science , 50, 1394-1400 (2015).

  • Alemu Tesfaye Negussie, Wahyu Diyatmika, C. M. Lee, Chia-chi Yu, Y.-L. Shen and C. H. Hsueh
    "Annealing-Induced Indentation Recovery in Thin Film Metallic Glasses: Effects of Indenter Tip Geometry, Film Thickness and Film Composition"
    Surface and Coatings Technology , 261, 350-355 (2015).

  • R. W. Johnson and Y.-L. Shen
    "Analysis of Thermal Stress and its Influence on Carrier Mobility in 3D Microelectronic Chip Stack"
    Journal of Electronic Packaging , 137, 021011 (2015).

  • Jesus D. Lerma, Tariq Khraishi, Sandeep Kataria and Yu-Lin Shen
    "Distributed Dislocation Method for Determining Elastic Fields of 2D and 3D Volume Misfit Particles in Infinite Space and Extension of the Method for Particles in a Half Space"
    Journal of Mechanics , 31, 249-260 (2015).

  • C. B. Blada and Y.-L. Shen
    "Cyclic Indentation Behavior of Layered Nanocomposites: A Viscoplastic Numerical Study"
    Journal of Nanomechanics and Micromechanics , 4, A4013001 (2014).

  • B. J. Rael and Y.-L. Shen
    "Flexural Strength and Fatigue Characterization of Exotensioned Composite Beams"
    Journal of Mechanics , 30, N1-N3 (2014).

  • D. N. Rogers and Y.-L. Shen
    "Deformation Localization in Constrained Layers of Metallic Glasses: A Parametric Modeling Analysis"
    Thin Solid Films , 561, 108-113 (2014).

  • R. W. Johnson and Y.-L. Shen
    "Analysis of Misalignment Induced Deformation in 3D Semiconductor Chip Stacks"
    Microelectronics International , 31, 61-70 (2014).

  • Alemu Tesfaye Negussie, Wahyu Diyatmika, J. P. Chu, Y.-L. Shen, J. S. C. Jang and C. H. Hsueh
    "Annealing-induced Shape Recovery in Thin Film Metallic Glass"
    Journal of Alloys and Compounds , 613, 157-163 (2014).

  • R. D. Jamison and Y.-L. Shen
    "Indentation Behavior of Multilayered Thin Films: Effects of Layer Undulation"
    Thin Solid Films , 570, 235-242 (2014).

  • Y.-L. Shen and R. W. Johnson
    "Misalignment Induced Shear Deformation in 3D Chip Stacking: A Parametric Numerical Assessment"
    Microelectronics Reliability , 53, 79-89 (2013).

  • C. B. Blada and Y.-L. Shen
    "Viscoplastic Analysis of Cyclic Indentation Behavior of Thin Metallic Films"
    Journal of Applied Physics , 113, 063510 (2013).

  • M. A. Neidigk and Y.-L. Shen
    "Predicting the Effect of Underfill Filler Volume Fraction on Solder Fatigue Life and Residual Stress for Surface Mount Components Using Nonlinear Viscoelastic Analyses"
    IEEE Transactions on Components, Packaging and Manufacturing Technology , 2, 1492-1500 (2012).

  • Y.-L. Shen, C. B. Blada, J. J. Williams and N. Chawla
    "Cyclic Indentation Behavior of Metal-Ceramic Nanolayered Composites"
    Materials Science and Engineering A , 557, 119-125 (2012).

  • E. J. Cheng and Y.-L. Shen
    "Thermal Expansion Behavior of Through-Silicon-Via Structures in Three-Dimensional Microelectronic Packaging"
    Microelectronics Reliability , 52, 534-540 (2012).

  • J. P. Chu, J. E. Greene, J. S.C. Jang, J. C. Huang, Y.-L. Shen, P. K. Liaw, Y. Yokoyama, A. Inoue and T. G. Nieh
    "Bendable Bulk Metallic Glass: Effects of a Thin, Adhesive, Strong, and Ductile Coating"
    Acta Materialia , 60, 3226-3238 (2012).

  • F.-L. Wen and Y.-L. Shen
    "Plastic Deformation in Multilayered Thin Films during Indentation Unloading: A Modeling Analysis Incorporating Viscoplastic Response"
    Mechanics of Time-Dependent Materials , 15, 277-291 (2011).

  • H. X. Xie, N. Chawla and Y.-L. Shen
    "Mechanisms of Deformation in High-Ductility Ce-Containing Sn-Ag-Cu Solder Alloys"
    Microelectronics Reliability , 51, 1142-1147 (2011).

  • K. Aluru, F.-L. Wen and Y.-L. Shen
    "Direct Simulation of Fatigue Failure in Solder Joints during Cyclic Shear"
    Materials & Design , 32, 1940-1947 (2011).

  • D. R. P. Singh, N. Chawla, G. Tang and Y.-L. Shen
    "Anomalous Viscoplasticity during Nanoindentation of Al/SiC Nanolaminated Composites"
    Materials Science and Engineering A , 528, 4608-4614 (2011).

  • Y.-L. Shen and K. Aluru
    "Numerical Study of Ductile Failure Morphology in Solder Joints under Fast Loading Conditions"
    Microelectronics Reliability , 50, 2059-2070 (2010).

  • G. Tang, Y.-L. Shen, D. R. P. Singh and N. Chawla
    "Indentation Behavior of Metal-Ceramic Multilayers at the Nanoscale: Numerical Analysis and Experimental Verification"
    Acta Materialia , 58, 2033-2044 (2010).

  • D. R. P. Singh, N. Chawla and Y.-L. Shen
    "Focused Ion Beam (FIB) Tomography of Nanoindentation Damage in Nanoscale Metal/Ceramic Multilayers"
    Materials Characterization , 61, 481-488 (2010).

  • T. A. Khraishi, Y.-L. Shen and Z. C. Leseman
    "Unveiling the Nature of Crystal Plasticity Using Straws"
    Journal of Vacuum Science and Technology B , 28, L13-L16 (2010).

  • P. L. Sun, J. P. Chu, T. Y. Lin, Y.-L. Shen and N. Chawla
    "Characterization of Nanoindentation Damage in Metal/Ceramic Multilayered Films by Transmission Electron Microscopy"
    Materials Science and Engineering A , 527, 2985-2992 (2010).

  • D. R. P. Singh, N. Chawla, G. Tang and Y.-L. Shen
    "Micropillar Compression of Al/SiC Nanolaminates"
    Acta Materialia , 58, 6628-6636 (2010).

  • D. R. P. Singh, X. Deng, N. Chawla, J. Bai, C. Hubbard, G. Tang and Y.-L. Shen
    "Residual Stress Characterization of Novel Al/SiC Nanoscale Multilayers using X-ray Synchrotron Radiation"
    Thin Solid Films , 519, 759-765 (2010).

  • K. Aluru, F.-L. Wen and Y.-L. Shen
    "Modeling of Solder Fatigue Failure due to Ductile Damage"
    Journal of Mechanics , 26, N23-N27 (2010).

  • G. Tang, D. R. P. Singh, Y.-L. Shen and N. Chawla
    "Elastic Properties of Metal-Ceramic Nanolaminates Measured by Nanoindentation"
    Materials Science and Engineering A , 502, 79-84 (2009).

  • M. A. Neidigk and Y.-L. Shen
    "Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer"
    ASME Journal of Electronic Packaging , 131, 011003 (2009).

  • Y.-L. Shen
    "Substrate-Constrained Deformation in Thin Metal Films: Numerical Case Studies"
    International Journal of Theoretical and Applied Multiscale Mechanics , 1, 57-70 (2009).

  • Y.-L. Shen and G. Tang
    "Effect of Material Heterogeneity on the Evolution of Internal Deformation during Nanoindentation"
    International Journal of Materials and Structural Integrity , 3, 102-113 (2009).

  • Y.-L. Shen
    "Externally Constrained Plastic Flow in Miniaturized Metallic Structures: A Continuum-based Approach to Thin Films, Lines and Joints"
    Progress in Materials Science , 53, 838-891 (2008).

  • Y.-L. Shen and M. Y. Al-Haik
    "Grain Boundary Mediated Dislocation Behavior in a 2D Bi-Crystal: A Model Atomistic Study"
    Journal of Computational and Theoretical Nanoscience , 5, 1318-1327 (2008).

  • R. S. McEntire and Y.-L. Shen
    "Parametric Variations of the Interatomic Potential in Atomistic Analysis of Nano-scale Metal Plasticity"
    International Journal of Mechanics and Materials in Design , 4, 361-374 (2008).

  • Y.-L. Shen
    "On the Elastic Assumption for Copper Lines in Interconnect Stress Modeling"
    IEEE Transactions on Device and Materials Reliability , 8, 600-607 (2008).

  • N. Chawla, D. R. P. Singh, Y.-L. Shen, G. Tang and K. K. Chawla
    "Indentation Mechanics and Fracture Behavior of Metal/Ceramic Nanolaminate Composites"
    Journal of Materials Science , 43, 4383-4390 (2008).

  • G. Tang, Y.-L. Shen, D. R. P. Singh and N. Chawla
    "Analysis of Indentation-Derived Effective Elastic Modulus of Metal-Ceramic Multilayers"
    International Journal of Mechanics and Materials in Design , 4, 391-398 (2008).

  • G. Tang, Y.-L. Shen and N. Chawla
    "Plastic Deformation during Indentation Unloading in Multilayered Materials"
    Journal of Applied Physics , 104, 116102 (2008).

  • R. S. McEntire and Y.-L. Shen
    "Atomistic Analysis of Crystal Plasticity in a Copper Nanowire during Tensile Loading"
    in Materials Science Research Trends, Chapter 2, pp. 133-149, 2008, Nova Publishers.

  • J. D. Lerma, T. Khraishi and Y.-L. Shen
    "Elastic Fields of 2D and 3D Misfit Particles in an Infinite Medium"
    Mechanics Research Communications , vol. 34, pp. 31-43 (2007).

  • A. Gouldstone, N. Chollacoop, M. Dao, J. Li, A. Minor and Y.-L. Shen
    "Indentation across Size Scales: Recent Developments in Experimentation and Modeling"
    Acta Materialia , vol. 55, pp. 4015-4039 (2007).

  • W. H. Moy and Y.-L. Shen
    "On the Failure Path in Shear-Tested Solder Joints"
    Microelectronics Reliability , vol. 34, pp. 31-43 (2007).

  • E. R. Olivas, J. G. Swadener and Y.-L. Shen
    "Nanoindentation Measurement of Surface Residual Stresses in Particle-Reinforced Metal Matrix Composites"
    Scripta Materialia , vol. 54, pp. 263-268 (2006).

  • Y.-L. Shen
    "Thermo-mechanical Stresses in Copper Interconnects: A Modeling Analysis"
    Microelectronic Engineering , vol. 83, pp. 446-459 (2006).

  • M. Mulholland, T. Khraishi, Y.-L. Shen and M. Horstemeyer
    "Void Growth and Interaction Experiments: Implications to the Optimal Straining Rate in Superplastic Forming"
    International Journal of Plasticity , vol. 22, pp. 1728-1744 (2006).

  • Y.-L. Shen and R. W. Leger
    "Parametric Atomistic Analysis of Dislocation-Interface Interactions in Thin Metallic Films"
    Materials Science and Engineering A , vol. 423, pp. 102-106 (2006).

  • M. Popova and Y.-L. Shen
    "Interaction between a Dislocation and a Nano-scale Penetrable Particle: A Model Atomistic Study"
    Journal of Computational and Theoretical Nanoscience , vol. 3, pp. 448-452 (2006).

  • S. Mukherjee, S. Murray, T. Khraishi and Y.-L. Shen
    "A Straw Model Simulating Nanoindentation"
    Molecular Simulation , vol. 32, pp. 339-343 (2006).

  • R. S. McEntire and Y.-L. Shen
    "An Atomistic Analysis of Incipient Metal Plasticity during Tensile Loading"
    Molecular Simulation , vol. 32, pp. 857-867 (2006).

  • S. Mukherjee, T. Khraishi and Y.-L. Shen
    "Modeling the Effects of Particles, Interstitials, Vacancies and Tip Geometry on Indentation-induced Plasticity"
    Molecular Simulation , vol. 32, pp. 655-660 (2006).

  • M. Popova, Y.-L. Shen and T. A. Khraishi
    "Atomistic Simulation of Dislocation Interactions in a Model Crystal Subjected to Shear"
    Molecular Simulation , vol. 31, pp. 1043-1049 (2005).

  • Y.-L. Shen
    "Analysis of Thermal Stresses in Copper Interconnect/Low-k Dielectric Structures"
    Journal of Electronic Materials , vol. 34, pp. 497-505 (2005).

  • X. H. Tan and Y.-L. Shen
    "Modeling Analysis of the Indentation-Derived Yield Properties of Metallic Multilayered Composites"
    Composites Science and Technology , vol. 65, pp. 1639-1646 (2005).

  • Y.-L. Shen, N. Chawla, E. S. Ege and X. Deng
    "Deformation Analysis of Lap Shear Testing of Solder Joints"
    Acta Materialia , vol. 53, pp. 2633-2642 (2005).

  • R. Pereyra and Y.-L. Shen
    "Characterization of Indentation-Induced 'Particle Crowding' in Metal Matrix Composites"
    International Journal of Damage Mechanics , vol. 14, pp. 197-213 (2005).

  • Y.-L. Shen and X. H. Tan
    "On the Correlation between Hardness and Yield S.trength in Multilayered Elastic-Plastic Materials"
    Journal of Materials Science , vol. 40, pp. 4683-4686 (2005).

  • Y.-L. Shen
    "On the Atomistic Simulation of Plastic Deformation and Fracture in Crystals"
    Journal of Materials Research , vol. 19, pp. 973-976 (2004).

  • T. A. Khraishi, L. Yan and Y.-L. Shen
    "Dynamic Simulation of Dislocation-Particle Interaction in Metal-Matrix Composites"
    International Journal of Plasticity , vol. 20, pp. 1039-1057 (2004).

  • Y.-L. Shen, K. C. R. Abell and S. E. Garrett
    "Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy"
    International Journal of Damage Mechanics , vol. 13, pp. 225-240 (2004).

  • R. W. Leger, Y.-L. Shen and T. A. Khraishi
    "Defect Nucleation during Nanoindentation: An Atomistic Analysis"
    Journal of Computational and Theoretical Nanoscience , vol. 1, pp. 261-264 (2004).

  • R. W. Leger, T. A. Khraishi and Y.-L. Shen
    "A Dislocation Dynamics Study of Strength Differential in Particle-Containing Metals during Cyclic Loading"
    Journal of Materials Science , vol. 39, pp. 3593-3604 (2004).

  • Y.-L. Shen and R. W. Leger
    "Atomistic Analysis of Nano-scale Crystal Plasticity in Thin Metal Films"
    Journal of Mechanics , vol. 20, pp. 1-12 (2004).

  • L. Yan, T. A. Khraishi, Y.-L. Shen and M. F. Horstemeyer
    "A Distributed-Dislocation Method for Treating Free-Surface Image Stresses in 3D Dislocation Dynamics Simulations"
    Modelling and Simulation in Materials Science and Engineering , vol. 12, pp. s289-s301 (2004).

  • R. Pereyra and Y.-L. Shen
    "Characterization of Particle Concentration in Indentation-Deformed Metal-Ceramic Composites"
    Materials Characterization , vol. 53, pp.373-380 (2004).

  • N. Chawla, Y.-L. Shen, X. Deng and E. S. Ege
    "An Evaluation of the Lap-Shear Test for Sn-rich Solder/Cu Couples: Experiments and Simulation"
    Journal of Electronic Materials , vol. 33, pp.1589-1595 (2004).

  • Y.-L. Shen
    "Thermomechanical Modeling of Metal Interconnects in Microelectronic Devices"
    in Recent Research Development in Materials Science IV, Part I, Chapter 6, pp. 125-155, Research Signpost, 2003.

  • Y.-L. Shen and U. Ramamurty
    "Constitutive Response of Passivated Copper Films to Thermal Cycling"
    Journal of Applied Physics , vol. 93, pp. 1806-1812 (2003).

  • B. D. Kozola and Y.-L. Shen
    "A Mechanistic Analysis of the Correlation between Overall Strength and Indentation Hardness in Discontinuously Reinforced Aluminum"
    Journal of Materials Science , vol. 38, pp. 901-907 (2003).

  • J. Lerma, T. Khraishi, Y.-L. Shen and B. D. Wirth
    "The Elastic Fields of Misfit Cylindrical Particles: A Dislocation-Based Numerical Approach"
    Mechanics Research Communications , vol. 30, pp. 325-334 (2003).

  • Y.-L. Shen and U. Ramamurty
    "Temperature Dependent Inelastic Response of Passivated Copper Films: Experiments, Analyses and Implications"
    Journal of Vacuum Science and Technology B, vol. 21, pp. 1258-1264 (2003).

  • M. M. Mulholland, E. S. Ege, T. A. Khraishi, M. F. Horstemeyer and Y.-L. Shen
    "Cavity Mediated Strain Localization and Overall Ductility in Eutectic Tin-Lead Alloy"
    Materials Science and Engineering A , vol. 360, pp.160-168 (2003).

  • Y.-L. Shen
    "Strength and Interface-Constrained Plasticity in Thin Metal Films"
    Journal of Materials Research , vol. 18, pp. 2281-2284 (2003).

  • E. S. Ege and Y.-L. Shen
    "Thermo-mechanical Response and Stress Analysis of Copper Interconnects"
    Journal of Electronic Materials , vol. 32, pp. 1000-1011 (2003).

  • K. C. R. Abell and Y.-L. Shen
    "Deformation Induced Phase Rearrangement in Near Eutectic Tin-Lead Alloy"
    Acta Materialia , vol. 50, pp. 3191-3202 (2002).

  • M. S. Kilijanski and Y.-L. Shen
    "Analysis of Thermal Stresses in Metal Interconnects with Multilevel Structures"
    Microelectronics Reliability , vol. 42, pp. 259-264 (2002).

  • Y.-L. Shen and K. C. R. Abell
    "Phase Realignment in Deformed Tin-Lead Eutectic"
    Journal of Materials Science Letters , vol. 21, pp. 631-633 (2002).

  • Y.-L. Shen and Y. L. Guo
    "Indentation Modeling of Heterogeneous Materials"
    Modelling and Simulation in Materials Science and Engineering , vol. 9, pp. 391-398 (2001).

  • Y.-L. Shen, J. J. Williams, G. Piotrowski, N. Chawla and Y. L. Guo
    "Correlation between Tensile and Indentation Behavior of Particle-Reinforced Metal Matrix Composites: An Experimental and Numerical Study"
    Acta Materialia , vol. 49, pp. 3219-3229 (2001).

  • T. Wilkins and Y.-L. Shen
    "Stress Enhancement at Inclusion Particles in Aluminum Matrix Composites: Computational Modeling and Implications to Fatigue Damage"
    Computational Materials Science , vol. 22, pp. 291-299 (2001).

  • Y.-L. Shen, M. C. Abeyta and H. E. Fang
    "Microstructural Changes in Eutectic Tin-Lead Alloy due to Severe Bending"
    Materials Science and Engineering A , vol. 308, pp. 288-291 (2001).

  • Y.-L. Shen
    "Local Joule Heating and Overall Resistance Increase in Void-Containing Aluminum Interconnects"
    Journal of Electronic Materials , vol. 30, pp. 367-371 (2001).

  • N. Chawla and Y.-L. Shen
    "Mechanical Behavior of Particle Reinforced Metal Matrix Composites - A Review"
    Advanced Engineering Materials, vol. 3, pp. 357-370 (2001).

  • Y.-L. Shen, W. Li and H. E. Fang
    "Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis"
    ASME Journal of Electronic Packaging , vol. 123, pp. 74-78 (2001).

  • Y.-L. Shen and N. Chawla
    "On the Correlation between Hardness and Tensile Strength in Particle Reinforced Metal Matrix Composites"
    Materials Science and Engineering A , vol. 297, pp. 44-47 (2001).

  • Y.-L. Shen, Y. L. Guo and C. A. Minor
    "Voiding Induced Stress Redistribution and its Reliability Implications in Metal Interconnects"
    Acta Materialia , vol. 48, pp. 1667-1678 (2000).

  • Y.-L. Shen, W. Li, D. L. Sulsky and H. L. Schreyer
    "Localization of Plastic Deformation along Grain Boundaries in a Hardening Material"
    International Journal of Mechanical Sciences , vol. 42, pp. 2167-2189 (2000).

  • Q. F. Duan and Y. -L. Shen
    "On the Prediction of Electromigration Voiding Using Stress-based Modeling"
    Journal of Applied Physics , vol. 87, pp. 4039-4041 (2000).

  • Y.-L. Shen, E. Fishencord and N. Chawla
    "Correlating Macrohardness and Tensile Behavior in Discontinuously Reinforced Metal Matrix Composites"
    Scripta Materialia , vol. 42, pp. 427-432 (2000).

  • N. Chawla, U. Habel, Y.-L. Shen, C. Andres, J.W. Jones, and J.E. Allison
    "Effect of Matrix Microstructure on the Tensile and Fatigue Behavior of SiC Particle Reinforced Al Matrix Composites"
    Metallurgical and Materials Transactions A , vol. 31A, pp. 531-540 (2000).

  • Y. -L. Shen
    "Analysis of Joule Heating in Multilevel Interconnects"
    Journal of Vacuum Science and Technology B , vol. 17, pp. 2115-2121 (1999).

  • C. A. Minor, Y. L. Guo and Y. -L. Shen
    "On the Propensity of Electromigration Void Growth from Pre-existing Stress-Voids in Metal Interconnects"
    Scripta Materialia , vol. 41, pp. 347-352 (1999).

  • Y. -L. Shen and Y. L. Guo
    "Designing Test Interconnect Structures for Micro-scale Stress Measurement: An Analytical Guidance"
    Journal of Vacuum Science and Technology B , vol. 17, pp. 448-454 (1999).

  • C. -T. Lin, Y. -L. Shen, R. Becker and S. Suresh
    "Grain Morphology, Texture and Microhardness Gradients in Aluminum Diffusion-Bonded to Aluminum Oxide"
    Acta Materialia , vol. 47, pp. 501-515 (1999).

  • Y. -L. Shen
    "Void Nucleation in Metal Interconnects: Combined Effects of Interface Flaws and Crystallographic Slip"
    Journal of Materials Research , vol. 14, pp. 584-591 (1999).

  • Y. -L. Shen
    "Stresses, Deformation, and Void Nucleation in Locally Debonded Metal Interconnects"
    Journal of Applied Physics , vol. 84, pp. 5525-5530 (1998).

  • Y. -L. Shen
    "Thermal Expansion of Metal-Ceramic Composites: A Three-Dimensional Analysis"
    Materials Science and Engineering A , vol. 252, pp. 269-275 (1998).

  • M. Chaturvedi and Y. -L. Shen
    "Thermal Expansion of Particle-Filled Plastic Encapsulant: A Micromechanical Characterization"
    Acta Materialia , vol. 46, pp. 4287-4302 (1998).

  • A. Gouldstone, Y. -L. Shen, S. Suresh and C. V. Thompson
    "Evolution of Stresses in Passivated and Unpassivated Metal Interconnects"
    Journal of Materials Research , vol. 13, pp. 1956-1966 (1998).

  • Y. -L. Shen, S. Suresh, M. Y. He, A. Bagchi, O. Kienzle, M. Ruhle and A. G. Evans
    "Stress Evolution in Passivated Thin Films of Cu on Silica Substrates"
    Journal of Materials Research , vol. 13, pp. 1928-1937 (1998).

  • Y. -L. Shen
    "Effects of Pre-existing Interfacial Defects on the Stress Evolution in Aluminum Interconnection Lines"
    IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A , vol. 21, pp. 127-131 (1998).

  • Y. -L. Shen
    "On the Formation of Voids in Thin-film Metal Interconnects"
    Scripta Materialia , vol. 37, 1805 (1997).

  • Y. -L. Shen
    "Combined Effects of Microvoids and Phase Contiguity on the Thermal Expansion of Metal-Ceramic Composites"
    Materials Science and Engineering A , vol. A237, 102 (1997).

  • Y. -L. Shen
    "Thermal Stresses in Multilevel Interconnections: Aluminum Lines at Different Levels"
    Journal of Materials Research , vol. 12, 2219 (1997).

  • Y. -L. Shen
    "Modeling of Thermal Stresses in Metal Interconnects: Effects of Line Aspect Ratio"
    Journal of Applied Physics , vol. 82, 1578 (1997).

  • D. K. Balch, T. J. Fitzgerald, V. J. Michaud, A. Mortensen, Y. -L. Shen and S. Suresh
    "Thermal Expansion of Metals Reinforced with Ceramic Particles and Microcellular Foams"
    Metallurgical and Materials Transactions A, vol. 27A, 3700 (1996).

  • Y. -L. Shen, S. Suresh and I. A. Blech
    "Stresses, Curvatures and Shape Changes Arising from Patterned Lines on Silicon Wafers"
    Journal of Applied Physics , vol. 80, 1388 (1996).

  • Y. -L. Shen and S. Suresh
    "Steady-State Creep of Metal-Ceramic Multilayered Materials"
    Acta Materialia , vol. 44, 1337 (1996).

  • Y. -L. Shen, S. Suresh and J. B. Bernstein
    "Laser Linking of Metal Interconnects: Analysis and Design Considerations"
    IEEE Transactions on Electron Devices , vol. 43, 402 (1996).

  • Y. -L. Shen and S. Suresh
    "Thermal Cycling and Stress Relaxation Response of Si-Al and Si-Al-SiO2 Multilayered Thin Films"
    Acta Metallurgica et Materialia , vol. 43, 3915 (1995).

  • Y. -L. Shen and S. Suresh
    "Elastoplastic Deformation of Multilayered Materials due to Thermal Cycling"
    Journal of Materials Research , vol. 10, 1200 (1995).

  • Y. -L. Shen, M. Finot, A. Needleman and S. Suresh
    "Effective Plastic Response of Two-Phase Composites"
    Acta Metallurgica et Materialia , vol. 43, 1701 (1995).

  • M. Finot, Y. -L. Shen, A. Needleman and S. Suresh
    "Micromechanical Modeling of Reinforcement Fracture in Particle-Reinforced Metal-Matrix Composites"
    Metallurgical and Materials Transactions A, vol. 25A, 2403 (1994).

  • Y. -L. Shen, A. Needleman and S. Suresh
    "Coefficient of Thermal Expansion of Metal-Matrix Composites for Electronic Packaging"
    Metallurgical and Materials Transactions A, vol. 25A, 839 (1994).

  • Y. -L. Shen, M. Finot, A. Needleman and S. Suresh
    "Effective Elastic Response of Two-Phase Composites"
    Acta Metallurgica et Materialia , vol. 42, 77 (1994)

  • Y. -L. Shen
    "A Note on the 19-degree Shear Bands in Rolled F.C.C. Metals"
    Scripta Metallurgica et Materialia , vol. 29, 1665 (1993).

  • Y. -L. Shen
    "An Analysis of Shear Band Formation in {100}<011> Textured F.C.C. Metals"
    Philosophical Magazine Letters , vol. 67, 73 (1993).

  • Y. -L. Shen
    "Comment on 'A Criterion for the Prediction of Shear Band Angles in F.C.C. Metals'"
    Scripta Metallurgica et Materialia , vol. 28, 145 (1993).

  • Y. -L. Shen
    "On the Shear Band Formation in F.C.C. Metals"
    Scripta Metallurgica et Materialia , vol. 25, 1081 (1991).

  • Y. -L. Shen, J. J. Chan and S. C. Chang
    "The Shear-Band Stress-Corrosion Cracking of an Aluminum-Lithium Alloy"
    Journal of Materials Science Letters , vol. 7, 787 (1988).


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